A recombination-controlled tunneling model is used to explain the strong frequency dispersion seen

in the accumulation capacitance and conductance of dielectric/n-In0.53Ga0.47As metal-oxidesemiconductor

capacitors. In this model, the parallel conductance is large when, at positive gate

biases, the metal Fermi level lines up with a large density of interface states in the In0.53Ga0.47As

band gap. It is shown that the model explains in a semi-quantitative manner the experimentally

observed capacitor characteristics, including a peak in parallel conductance/frequency (Gp=x) versus

log frequency curves at positive gate bias and the dependence of the frequency dispersion on the

dielectric thickness.

Polarization gradients in graded AlGaN alloys induce bulk electron distributions without the use of impurity doping. Since the alloy composition is not constant in these structures, the electron scattering rates vary across the structure. Capacitance and conductivity measurements on field effect transistors were used to find mobility as a function of depth. The effective electron mobility at different depths calculated from theory closely matched the measured mobility. Local bulk mobility values for different AlGaN compositions were found, and the electron mobility in AlGaN as a function of alloy composition was deduced. These were found to match with theoretical calculations.

We discuss an AlGaN/GaN metal-semiconductor field-effect transistor (MESFET) structure grown without any impurity doping in the channel. A high-mobility polarization-induced bulk channel charge was created by grading the channel region linearly from GaN to Al0.3Ga0.7N over 1000 Angstrom. This polarization-doped FET (PolFET) was fabricated and tested under dc and rf conditions. Current density of 850 mA/mm and transconductance of 93 mS/mm was observed under dc conditions. The 0.7 mum gate length devices had a cutoff frequency, f(tau)=19 GHz, and maximum oscillation frequency, f(max)=46 GHz. We demonstrate that the PolFETs perform better than comparable MESFETs with impurity-doped channels, and are suitable for high power microwave applications. An important advantage of these devices over AlGaN/GaN high electron mobility transistors is that the transconductance versus gate voltage profile can be tailored by compositional grading for better large-signal linearity. (C) 2004 American Institute of Physics.

We describe the development of N-polar GaN-based high electron mobility transistors grown by N-2 plasma-assisted molecular beam epitaxy on C-face SiC substrates. High mobility AlGaN/GaN modulation-doped two-dimensional electron gas channels were grown, and transistors with excellent dc and small-signal performance were fabricated on these wafers. Large-signal dispersion was observed, and the trap states responsible for this were identified, and layer designs to remove the dispersive effects of these traps were demonstrated. Finally, an AlGaN-cap layer was used to reduce gate leakage in these devices, and a low-dispersion high breakdown voltage device was achieved. This detailed study of dispersion and leakage in N-polar GaN-based transistors establishes a technological base for further development of field effect devices based on N-polar III-nitrides. (C) 2007 American Institute of Physics.

We report AlGaN-GaN high electron mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) on SiC substrates with excellent microwave power and efficiency performance. The GaN buffers in these samples were doped with carbon to make them insulating. To reduce gate leakage, a thin silicon nitride film was deposited on the AlGaN surface by chemical vapor deposition. At 4 GHz, an output power density of 6.6 W/mm was obtained with 57% power-added efficiency (PAE) and a gain of 10, dB at a drain bias of 35 V. This is the highest PAE reported until now at 4 GHz in AlGaN-GaN HEMTs grown by MBE. At 10 GHz, we measured an output power density of 7.3 W/mm with a PAE of 36% and gain of 7.6 dB at 40-V drain bias.