Skip to main content
eScholarship
Open Access Publications from the University of California

Scholarly Works (2 results)

  • Article
  • Peer Reviewed
UCLA Previously Published Works (2018)
    Cover page: Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration
    • Article
    • Peer Reviewed
    UCLA Previously Published Works (2018)
      Cover page: Extremely Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 μm) and Reliable Flexible Cu-based Interconnects
      Top