We report on the use of in-situ SiNx nanomask for defect reduction in nonpolar a-plane GaN films, grown by metal-organic chemical vapor deposition. High-resolution x-ray diffraction analysis revealed that there was a monotonic reduction in the full width at half maximum, both on-axis and off-axis, with the increase in the SiNx thickness. Atomic force microscopy images revealed a significant decrease in the root-mean-square roughness and the density of submicron pits. Cross-section and plan-view transmission electron microscopy on the samples showed that the stacking fault density decreased from 8x10(5) to 3x10(5) cm(-1) and threading dislocation density decreased from 8x10(10) to 9x10(9) cm(-2). Room temperature photoluminescence measurement revealed that the band-edge emission intensity increased with the insertion of the SiNx layer, which suggests reduction in the nonradiative recombination centers. (c) 2006 American Institute of Physics.

(0001)-oriented epitaxial wurtzite III-nitride layers grown on mismatched substrates have no resolved shear stress on the natural basal and prismatic slip planes; however, strained Ill-nitride layers may gradually relax. We report on the stress relaxation of Al0.49Ga0.51N layers grown on nominally relaxed Al0.62Ga0.38N buffer layers on sapphire. The reduction in elastic strain of the Al0.49Ga0.51N was enhanced by Si doping which caused an increased surface roughness. Despite the Si doping, the films always sustained step-flow growth. The extent of relaxation of the Al0.49Ga0.51N layer was determined by on-axis omega-2 theta scans of (0001) peaks and reciprocal space maps of inclined (off-axis) peaks. Cross-section and plan-view transmission electron microscopy studies showed that the threading dislocations in the Al(0.49)Gao(0.5)N layer inclined from the [0001] direction towards (1 (1) over bar 00) directions by similar to 15-25 degrees, perpendicular to their Burgers vector (1/3 ) These inclined threading dislocations have a misfit dislocation component and thus provide stress relief. The contribution of the dislocation inclination to the degree of relaxation has been formulated and the energy release has been determined for dislocation inclination in mismatched stressed layers. (c) 2005 American Institute of Physics.

Polarization gradients in graded AlGaN alloys induce bulk electron distributions without the use of impurity doping. Since the alloy composition is not constant in these structures, the electron scattering rates vary across the structure. Capacitance and conductivity measurements on field effect transistors were used to find mobility as a function of depth. The effective electron mobility at different depths calculated from theory closely matched the measured mobility. Local bulk mobility values for different AlGaN compositions were found, and the electron mobility in AlGaN as a function of alloy composition was deduced. These were found to match with theoretical calculations. (c) 2006 American Institute of Physics.

We discuss an AlGaN/GaN metal-semiconductor field-effect transistor (MESFET) structure grown without any impurity doping in the channel. A high-mobility polarization-induced bulk channel charge was created by grading the channel region linearly from GaN to Al0.3Ga0.7N over 1000 Angstrom. This polarization-doped FET (PolFET) was fabricated and tested under dc and rf conditions. Current density of 850 mA/mm and transconductance of 93 mS/mm was observed under dc conditions. The 0.7 mum gate length devices had a cutoff frequency, f(tau)=19 GHz, and maximum oscillation frequency, f(max)=46 GHz. We demonstrate that the PolFETs perform better than comparable MESFETs with impurity-doped channels, and are suitable for high power microwave applications. An important advantage of these devices over AlGaN/GaN high electron mobility transistors is that the transconductance versus gate voltage profile can be tailored by compositional grading for better large-signal linearity. (C) 2004 American Institute of Physics.

Polarity and dislocation dependence study of photoelectrochemical wet etching on GaN was carried out on lateral epitaxial overgrown nonpolar (11 (2) over bar0)a-GaN/(1 (1) over bar 02)r-plane sapphire substrate. This LEO nonpolar GaN sample has low dislocation density Ga- and N-faces exposed horizontally in opposite directions, which can be exposed to identical etching conditions for both polarity and dislocation dependence study. It is observed that N-face GaN is essentially much chemically active than Ga-face GaN, which shows the hexagonal pyramids with {10 (1) over bar(1) over bar} facets on the etched N face. No obvious etching was observed on Ga face in the same etch condition. As for dislocation dependence, the "wing" (low dislocation density) region was etched faster than the "window" (high dislocation density) region. Smooth etched surfaces were formed with the ((1) over bar(1) over bar2 (2) over bar) facet as an etch stop plane both on Ga and N-wing region. (C) 2004 American Institute of Physics.

The influence of AlGaN and GaN cap layer thickness on Hall sheet carrier density and mobility was investigated for Al0.32Ga0.68N/GaN and GaN/Al0.32Ga0.68N/GaN heterostructures deposited on sapphire substrates. The sheet carrier density was found to increase and saturate with the AlGaN layer thickness, while for the GaN-capped structures it decreased and saturated with the GaN cap layer thickness. A relatively close fit was achieved between the measured data and two-dimensional electron gas densities predicted from simulations of the band diagrams. The simulations also indicated the presence of a two-dimensional hole gas at the upper interface of GaN/AlGaN/GaN structures with sufficiently thick GaN cap layers. A surface Fermi-level pinning position of 1.7 eV for AlGaN and 0.9-1.0 eV for GaN, and an interface polarization charge density of 1.6x10(13)-1.7x10(13) cm(-2), were extracted from the simulations. (C) 2003 American Institute of Physics.

N-p-n Al0.05GaN/GaN heterojunction bipolar transistors with a common emitter operation voltage higher than 330 V have been demonstrated using selectively regrown emitters. Devices were grown by metalorganic chemical vapor deposition on sapphire substrates. The n-type emitter was grown selectively on a 100-nm-thick p-base with an 8 mum n-collector structure using a dielectric mask. The shallow etch down to the collector mitigates damages induced in the dry etch, resulting a low leakage and a high breakdown. The graded AlGaN emitter results in a common emitter current gain of similar to18 at an average collector current density of up to 1 kA/cm(2) at room temperature.

The impact of threading dislocation density on Ni/n-GaN Schottky barrier diode characteristics is investigated using forward biased current-voltage-temperature (I-V-T) and internal photoemission (IPE) measurements. Nominally, identical metal-organic chemical vapor deposition grown GaN layers were grown on two types of GaN templates on sapphire substrates to controllably vary threading dislocation density (TDD) from 3x10(7) to 7x10(8) cm(-2). I-V-T measurements revealed thermionic emission to be the dominant transport mechanism with ideality factors near 1.01 at room temperature for both sample types. The Schottky barrier heights showed a similar invariance with TDD, with measured values of 1.12-1.13 eV obtained from fitting the I-V-T results to a thermionic emission-diffusion model. The I-V-T results were verified by IPE measurements made on the same diodes, confirming that the Ni/n-GaN barrier heights do not show a measurable TDD dependence for the TDD range measured here. In apparent contrast to this result is that the measured forward bias I-V characteristics indicate a shift in the observed forward bias turn-on voltage such that at the higher TDD value investigated here, a larger turn-on voltage (lower current) is observed. This difference is attributed to localized current blocking by high potential barrier regions surrounding threading dislocations that intersect the Ni/GaN interface. A simple model is presented that reconciles both the observed voltage shift and variations in the extracted Richardson constant as a function of threading dislocation density. With this model, an average local barrier surrounding dislocation of similar to 0.2 V is obtained, which diverts current flow across the forward biased Schottky interface to nondislocated regions. (c) 2006 American Institute of Physics.

Deep levels were observed using capacitance deep level optical spectroscopy (DLOS) in an AlGaN/GaN heterostructure equivalent to that of a heterojunction field effect transistor. Band gap states were assigned to either the AlGaN or GaN regions by comparing the DLOS spectra in accumulation and pinch-off modes, where the former reflects both AlGaN- and GaN-related defects, and the latter emphasizes defects residing in the GaN. A band gap state at E-c-3.85 eV was unambiguously identified with the AlGaN region, and deep levels at E-c-2.64 eV and E-c-3.30 eV were associated with the GaN layers. Both the AlGaN and GaN layers exhibited additional deep levels with large lattice relaxation. The influence of deep levels on the two-dimensional electron gas sheet charge was estimated using a lighted capacitance-voltage method. (c) 2006 American Institute of Physics.

AlGaN/GaN current aperture vertical electron transistors with regrown aperture and source regions have been fabricated and tested. A 2 mum thick GaN:Si drain region followed by a 0.4 mum GaN:Mg current-blocking layer were grown by metalorganic chemical vapor deposition on a c-plane sapphire substrate. Channel apertures were etched, and a maskless regrowth was performed to grow unintentionally doped GaN inside the aperture as well as above the insulating layer, and to add an AlGaN cap layer. Cl-2 reactive ion etching was used to pattern the device mesa, and source, drain, and gate metals were then deposited. Devices were achieved with a maximum source-drain current of 750 mA/mm, an extrinsic transconductance of 120 mS/mm, and a 2-terminal gate breakdown of 65 V while exhibiting almost no DC-RF dispersion for 80 mus pulsed I-V curves. The suppression of DC-RF dispersion was shown to result from the absence of the large electric fields at the surface on the drain-side edge of the gate that are present in high electron mobility transistors. Parasitic leakage currents, which were present in all devices, have been studied in detail. Three leakage paths have been identified, and methods to eliminate them are discussed. (C) 2004 American Institute of Physics.