In the relentless pursuit for energy-efficient electronics targeted for next-generation high-performance computing, artificial intelligence, and for realizing large-scale quantum computers, hardware platforms based on conventional electronic systems suffer from several fundamental challenges. This dissertation focuses on addressing these challenges using a new hardware platform based on two-dimensional (2D) layered materials, which, due to their unique electrical, thermal, and physical properties, can be judiciously exploited for revolutionizing these applications. First, I talk about the benefits of using graphene as a prospective interconnect technology for the most aggressively scaled wiring dimensions in state-of-the-art ICs, which suffer from severe resistance increase and reliability challenges. I demonstrate the benefits of using graphene for designing sub-20 nm wires, comprising a unique CMOS-compatible graphene growth technique, followed by graphene interconnect fabrication, electrical and reliability characterization, and performance projections, that has established its advantages over conventional metals for next-generation energy-efficient electronics, and is being actively pursued by the industry. Second, I demonstrate the full potential of using graphene in designing high-performance inductors, where the high kinetic inductance of graphene can be uniquely exploited to address the various high-frequency challenges (such as skin effect, proximity effect, substrate coupling) encountered during GHz frequencies of operation. By developing a comprehensive model which captures the intricate physics of kinetic inductance, we provide guidelines for optimally exploiting kinetic inductance to simultaneously achieve maximum inductance-density and performance, thereby laying the foundation, and demonstrating the potential for designing ultra-energy-efficient high-density passives for next-generation RFICs using these two-dimensional materials. Finally, I evaluate the prospects of using 2D-materials for designing the cryogenic-interface electronics which can enable next-generation large-scale quantum computing. By performing extensive ab-initio density functional theory and quantum transport simulations, I reveal that the excellent structural and physical properties of these 2D-materials enable them to be utilized for cryogenic field-effect-transistors with ultra-low supply voltages, minimal device-to-device variation, and unprecedented improvements in energy-efficiency and performance, thereby paving the way for next-generation cryo-electronics and large-scale quantum computers. Therefore, by judiciously exploiting the various electrical, thermal, and physical properties of these 2D materials, significant improvements in performance and energy-efficiency beyond what is currently achievable can be realized, leading to a smarter life.